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Timestamp: March 14, 2026 at 12:56 AM

Major Chinese Tech Giants and Appliance Manufacturers Unite to Publish Unified Smart Home Interconnection Standard

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At AWE 2026, GIIC Global Smart IoT Alliance, together with leading Chinese appliance manufacturers including Haier, Midea, Hisense, TCL, OPPEIN, and Bull Group, along with industry partners Huawei, Shanghai HiSilicon, and China Mobile, jointly released the "Unified Smart Home Interconnection Standard." This groundbreaking standard aims to enable seamless interoperability across different brands of smart home devices, building upon the HarmonyOS Ecosystem Device Unified Interconnection Standard 2.0 released in 2025. The standard incorporates the domestic Star Flash protocol and addresses data and security compliance requirements.

At the 2026 China Home Appliances & Consumer Electronics Expo (AWE 2026), a significant milestone was achieved in the smart home industry as major technology companies and appliance manufacturers came together to publish the "Unified Smart Home Interconnection Standard."

The standard was jointly released by the GIIC Global Smart IoT Alliance's Smart Home Working Committee, in collaboration with the China Household Electric Appliance Research Institute. Leading家电 enterprises including Haier, Midea, Hisense, TCL, OPPEIN, and Bull Group participated alongside industry partners such as Huawei, Shanghai HiSilicon, and China Mobile.

This unified standard is built upon the foundation of the "HarmonyOS Ecosystem Device Unified Interconnection Standard 2.0" released by GIIC in 2025. It aims to define unified specifications for device discovery, network configuration, access authentication, and control interfaces among smart home ecosystem devices, enabling different manufacturers' devices to achieve true interoperability.

The standard incorporates scene-based requirements and details, adapts to domestically-developed protocols such as Star Flash (星闪), and complies with relevant data and security regulations.

As a key participant and technical supporter in standard development, Shanghai HiSilicon's "HarmonyOS Star Flash Unified Smart Connection" solution fully supports the new standard. The solution enables smart home connectivity through three phases: convenient network configuration, interconnection and interoperability, and AI collaboration.

At the AWE 2026 exhibition venue, Shanghai HiSilicon demonstrated the interconnection capabilities of its HarmonyOS Star Flash Unified Smart Connection solution across three different hub scenarios: screenless hubs, small-screen hubs, and AI-powered medium-screen hubs.

The solution will include unified interconnection components for IoT devices, unified interconnection components for hubs and gateways, and AI Agent intelligent body components. The IoT device and hub/gateway unified interconnection components will soon be available on Shanghai HiSilicon's HiSpark community.

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This initiative represents a massive leap forward for the global smart home ecosystem by finally tackling the fragmentation that has plagued the industry for years. The collaboration among heavyweights like Haier, Midea, and Huawei to establish a unified standard creates a much-needed interoperability framework that benefits both manufacturers and consumers. By building upon HarmonyOS 2.0 and integrating Star Flash, this move ensures that devices can finally communicate seamlessly without requiring proprietary bridges. Additionally, the inclusion of security and compliance protocols addresses a critical concern for users, proving that convenience can be achieved without sacrificing data protection.

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This initiative marks a significant turning point for the IoT industry. Moving away from fragmented, proprietary ecosystems toward a unified standard is exactly what the smart home sector needs to mature. By leveraging the HarmonyOS foundation and integrating the domestic Star Flash protocol, this collaboration ensures not just convenience but also robust security and low-latency performance. It is exciting to witness giants like Haier, Huawei, and Midea prioritizing interoperability over isolated competition. This unified approach will drastically lower the barrier for consumers and accelerate the adoption of truly intelligent living environments, showcasing the strength of collaborative innovation within the Chinese tech community.